-
1
-
-
0035872897
-
High-k gate dielectrics: current status and materials properties considerations
-
Wilk G.D., Wallace R.M., and Anthony J.M. High-k gate dielectrics: current status and materials properties considerations. J Appl Phys 89 (2001) 5243
-
(2001)
J Appl Phys
, vol.89
, pp. 5243
-
-
Wilk, G.D.1
Wallace, R.M.2
Anthony, J.M.3
-
2
-
-
37149004271
-
Effects and mechanisms of nitrogen incorporation into hafnium oxide by plasma immersion ion implantation
-
Wong H., Sen B., Yang B.L., Huang A.P., and Chu P.K. Effects and mechanisms of nitrogen incorporation into hafnium oxide by plasma immersion ion implantation. J Vac Sci Technol B 25 (2007) 1853
-
(2007)
J Vac Sci Technol B
, vol.25
, pp. 1853
-
-
Wong, H.1
Sen, B.2
Yang, B.L.3
Huang, A.P.4
Chu, P.K.5
-
4
-
-
33746862976
-
On the scaling issues and high-κ replacement of ultrathin gate dielectrics for nanoscale MOS transistors
-
Wong H., and Iwai H. On the scaling issues and high-κ replacement of ultrathin gate dielectrics for nanoscale MOS transistors. Microelectron Eng 83 (2006) 1867
-
(2006)
Microelectron Eng
, vol.83
, pp. 1867
-
-
Wong, H.1
Iwai, H.2
-
5
-
-
33645162877
-
Effects of nitrogen atom doping on dielectric constants of Hf-based gate oxides
-
Momida H., Hamada T., Yamamoto T., Uda T., Umezawa N., Chikyow T., et al. Effects of nitrogen atom doping on dielectric constants of Hf-based gate oxides. Appl Phys Lett 88 (2006) 112903
-
(2006)
Appl Phys Lett
, vol.88
, pp. 112903
-
-
Momida, H.1
Hamada, T.2
Yamamoto, T.3
Uda, T.4
Umezawa, N.5
Chikyow, T.6
-
6
-
-
26644444366
-
Characteristics of hafnium-aluminum-oxide thin films deposited by using atomic layer deposition with various aluminum compositions
-
Koo J., Lee J., Kim S., Kim Y.D., Jeon H., Kim D.S., et al. Characteristics of hafnium-aluminum-oxide thin films deposited by using atomic layer deposition with various aluminum compositions. J Korean Phys Soc 47 (2005) 501
-
(2005)
J Korean Phys Soc
, vol.47
, pp. 501
-
-
Koo, J.1
Lee, J.2
Kim, S.3
Kim, Y.D.4
Jeon, H.5
Kim, D.S.6
-
9
-
-
0029338621
-
Synthesis and structure of tributylammonium hexanitrate lanthanum
-
Yan C., Zhang Y., Gao S., Li B., Huang C., and Xu G. Synthesis and structure of tributylammonium hexanitrate lanthanum. J Alloys Compd 225 (1995) 385
-
(1995)
J Alloys Compd
, vol.225
, pp. 385
-
-
Yan, C.1
Zhang, Y.2
Gao, S.3
Li, B.4
Huang, C.5
Xu, G.6
-
11
-
-
33947617880
-
Trapping characteristics of lanthanum oxide gate dielectric film explored from temperature dependent current-voltage and capacitance-voltage measurements
-
Sen B., Wong H., Molina J., Iwai H., Ng J.A., Kakushima K., et al. Trapping characteristics of lanthanum oxide gate dielectric film explored from temperature dependent current-voltage and capacitance-voltage measurements. Solid State Electron 51 (2007) 475
-
(2007)
Solid State Electron
, vol.51
, pp. 475
-
-
Sen, B.1
Wong, H.2
Molina, J.3
Iwai, H.4
Ng, J.A.5
Kakushima, K.6
-
12
-
-
0036544455
-
Interface reaction of a silicon substrate and lanthanum oxide films deposited by metalorganic chemical vapor deposition
-
Yamada H., Shimizu T., and Suzuki E. Interface reaction of a silicon substrate and lanthanum oxide films deposited by metalorganic chemical vapor deposition. Jpn J Appl Phys 41 (2002)
-
(2002)
Jpn J Appl Phys
, vol.41
-
-
Yamada, H.1
Shimizu, T.2
Suzuki, E.3
-
13
-
-
61349090010
-
-
National Institute of Standards and Technology XPS database
-
National Institute of Standards and Technology XPS database. .
-
-
-
-
14
-
-
34248652811
-
Thermal stability of lanthanum oxynitride ultrathin films deposited on silicon substrates
-
Kawada N., Ito M., and Saito Y. Thermal stability of lanthanum oxynitride ultrathin films deposited on silicon substrates. Jpn J Appl Phys 12 (2006)
-
(2006)
Jpn J Appl Phys
, vol.12
-
-
Kawada, N.1
Ito, M.2
Saito, Y.3
-
15
-
-
43049170079
-
Electrical stability improvement for lanthanum oxide films by nitrogen incorporation using plasma immersion ion implantation
-
Tainan;
-
Sen B, Yang BL, Wong H, Kok CW, Bera MK, Chu PK, et al. Electrical stability improvement for lanthanum oxide films by nitrogen incorporation using plasma immersion ion implantation. In: Proceedings of IEEE international conference on electron devices and solid state circuits, Tainan; 2007. p. 637.
-
(2007)
Proceedings of IEEE international conference on electron devices and solid state circuits
, pp. 637
-
-
Sen, B.1
Yang, B.L.2
Wong, H.3
Kok, C.W.4
Bera, M.K.5
Chu, P.K.6
-
17
-
-
0037175936
-
Interfacial oxide formation and oxygen diffusion in rare earth oxide - silicon epitaxial heterostructures
-
Narayanan V., Guha S., Copel M., Bojarczuk N.A., Flaitz P.L., and Gribelyuk M. Interfacial oxide formation and oxygen diffusion in rare earth oxide - silicon epitaxial heterostructures. Appl Phys Lett 81 (2002) 4183
-
(2002)
Appl Phys Lett
, vol.81
, pp. 4183
-
-
Narayanan, V.1
Guha, S.2
Copel, M.3
Bojarczuk, N.A.4
Flaitz, P.L.5
Gribelyuk, M.6
-
20
-
-
55649093319
-
Effects of aluminum incorporation on hafnium oxide film using plasma immersion ion implantation
-
Sen B., Yang B.L., Wong H., Kok C.W., Chu P.K., and Huang A. Effects of aluminum incorporation on hafnium oxide film using plasma immersion ion implantation. Microelectron Reliab 48 (2008) 1765
-
(2008)
Microelectron Reliab
, vol.48
, pp. 1765
-
-
Sen, B.1
Yang, B.L.2
Wong, H.3
Kok, C.W.4
Chu, P.K.5
Huang, A.6
|