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1
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24944554984
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The road to miniaturization
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Wong H., and Iwai H. The road to miniaturization. Phys World 18 9 (2005) 40-44
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(2005)
Phys World
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Wong, H.1
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2
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23244462592
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High-k gate dielectrics
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Misra D., Iwai H., and Wong H. High-k gate dielectrics. Interface 14 2 (2005) 30-34
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Interface
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Misra, D.1
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3
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0035872897
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High-k gate dielectrics: current status and materials properties considerations
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Wilk G.D., Wallace R.M., and Anthony J.M. High-k gate dielectrics: current status and materials properties considerations. J Appl Phys 89 10 (2001) 5243-7275
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J Appl Phys
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Wilk, G.D.1
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Anthony, J.M.3
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4
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33746862976
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On the scaling issues and high-κ replacement of ultrathin gate dielectrics for nanoscale MOS transistors
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Wong H., and Iwai H. On the scaling issues and high-κ replacement of ultrathin gate dielectrics for nanoscale MOS transistors. Microelectron Eng 83 (2006) 1867-1904
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(2006)
Microelectron Eng
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Wong, H.1
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5
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0035498635
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Ultrathin high-k metal oxide on silicon: processing, characterization and integration issues
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Gusev E.P., Cartier E., Buchanan D.A., Gribelyuk M., Copel M., Okorn-Schmidt H., et al. Ultrathin high-k metal oxide on silicon: processing, characterization and integration issues. Microelectron Eng 59 (2001) 341-349
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Microelectron Eng
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Gusev, E.P.1
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Gribelyuk, M.4
Copel, M.5
Okorn-Schmidt, H.6
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6
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3242693485
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Interface bonding structure of hafnium oxide prepared by direct sputtering of hafnium in oxygen
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Wong H., Ng K.L., Zhan N., Poon M.C., and Kok C.W. Interface bonding structure of hafnium oxide prepared by direct sputtering of hafnium in oxygen. J Vac Sci Technol B 22 (2004) 1094-1100
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(2004)
J Vac Sci Technol B
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Wong, H.1
Ng, K.L.2
Zhan, N.3
Poon, M.C.4
Kok, C.W.5
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7
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0035477585
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High temperature stability in lanthanum and zirconia-based gate dielectrics
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Maria J.P., Wicaksana D., Kingon A.I., Busch B., Schulte H., Garfunkel E., et al. High temperature stability in lanthanum and zirconia-based gate dielectrics. J Appl Phys 90 (2001) 3476-3482
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J Appl Phys
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Maria, J.P.1
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11
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Nohira H, Hattori T. Thermal stability of lanthanum oxide/Si(100) interfacial transition layer, In: International workshop on nano CMOS, Mishima, Japan, 20 Jan-1 Feb, 2006. p. 18.
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14
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33947701602
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Nasyrov KA, Gritsenko VA, Novikov Yu N, Gritsenko DV, Lee JH, Lee J-W, et al. Charge transport mechanism in silicon nitride: Frenkel effect or multi-phonon trap ionization? unpublished.
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15
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0035504954
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Effective electron mobility in Si inversion layers in metal-oxide-semiconductor systems with a high-kappa insulator: the role of remote phonon scattering
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Fischetti M.V., Neumayer D.A., and Cartier E.A. Effective electron mobility in Si inversion layers in metal-oxide-semiconductor systems with a high-kappa insulator: the role of remote phonon scattering. J Appl Phys 90 (2001) 4587-4608
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Fischetti, M.V.1
Neumayer, D.A.2
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16
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Mechanism for stressing-induced leakage current in thin silicon dioxide films
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Maria D.J., and Cartier E. Mechanism for stressing-induced leakage current in thin silicon dioxide films. J Appl Phys 78 (1995) 3883-3894
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Maria, D.J.1
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17
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Current conduction mechanism in thin gate dielectrics
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Yang B.L., Lai P.T., and Wong H. Current conduction mechanism in thin gate dielectrics. Microelectron Reliab 44 (2004) 709-718
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(2004)
Microelectron Reliab
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Yang, B.L.1
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Wong, H.3
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18
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0012699422
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Electronic conduction mechanism in thin oxynitride films
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Wong H., and Cheng Y.C. Electronic conduction mechanism in thin oxynitride films. J Appl Phys 70 (1991) 1078-1080
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J Appl Phys
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Wong, H.1
Cheng, Y.C.2
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19
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0030101890
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Modeling of trap-assisted current conduction in thin thermally nitrided oxide films
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Yang B.L., Wong H., and Cheng Y.C. Modeling of trap-assisted current conduction in thin thermally nitrided oxide films. Solid-State Electron 39 (1996) 385-390
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Solid-State Electron
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Yang, B.L.1
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