Intermetallic formation induced substrate dissolution in electroless Ni(P)-solder interconnections

Journal of Materials Research

Volumn 23, Issue 9, 2008, Pages 2545-2554

  Song, Jenn Ming ^a   Liu, Yao Ren ^a   Su, Chien Wei ^a   Lai, Yi Shao ^b   Chiu, Ying Ta ^b  

^a NATIONAL DONG HWA UNIVERSITY   (Taiwan)

^b ADVANCED SEMICONDUCTOR ENGINEERING INC   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

BRAZING; COPPER; COPPER ALLOYS; DISSOLUTION; DOPING (ADDITIVES); ELECTROLESS PLATING; METAL RECOVERY; METALS; NICKEL; NICKEL ALLOYS; SILVER; TIN; TIN ALLOYS; TRANSITION METALS; WELDING; ZINC;

ELECTROLESS NI-P; INTERFACIAL REACTIONS; INTERMETALLIC FORMATION; SN-AG-CU; SOLDER INTER CONNECTIONS; SOLDER JOINTS;

SOLDERING ALLOYS;

EID: 52649139513     PISSN: 08842914     EISSN: None     Source Type: Journal    
DOI: 10.1557/jmr.2008.0318     Document Type: Article

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