Competition between dislocation nucleation and void formation as the stress relaxation mechanism in passivated Cu interconnects

Thin Solid Films

Volumn 517, Issue 9, 2009, Pages 2936-2940

  Zhang, J ^a   Zhang, J Y ^a   Liu, G ^a   Zhao, Y ^a   Sun, J ^a  

^a XI'AN JIAOTONG UNIVERSITY   (China)

Author keywords

Cu interconnects; Stress relaxation mechanisms

Indexed keywords

ASPECT RATIO; COMPETITION; NUCLEATION; OPTICAL INTERCONNECTS; PRESSURE DROP; RESIDUAL STRESSES; STRAIN HARDENING; STRESS RELAXATION;

CRITICAL ASPECT RATIOS; CU INTERCONNECTS; CU LINES; DISLOCATION NUCLEATIONS; INTERFACIAL STRENGTHS; KINEMATIC STRAIN HARDENINGS; LENGTH-SCALE; PLASTIC MODELS; POTENTIAL APPLICATIONS; STRESS RELAXATION MECHANISMS; VOID FORMATIONS;

COPPER;

EID: 60249083118     PISSN: 00406090     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.tsf.2008.12.031     Document Type: Article

References (26)

1. Suo Z. Reliability of Interconnects Structures (2003), Elsevier Science Ltd.
2. Borgesen P., Lee J.K., Gleixner R., and Li C.Y. Appl. Phys. Lett. 60 (1992) 1706
3. Nucci J.A. Appl. Phys. Lett. 66 (1995) 3585
4. Shao W., and Gan Z.H. Thin Solid Films 504 (2006) 298
5. Ang D., and Ramanujan R.V. Mater. Sci. Eng. A423 (2006) 157
6. Ang D., Wong C.C., and Ramanujan R.V. Thin Solid Films 515 (2007) 3246
7. Gan D.W., Wang G.T., Ho P.S., Morrow X., and Leu J.P. 5th Annual International Interconnect Technology Conference, Proceedings of the IEEE 2002 International Interconnect Technology Conference, Burlingame, U.S.A. (June 3-5, 2002) 271
8. Shen Y.L. J. Appl. Phys. 82 (1997) 1578
9. An J.H., and Ferreira P.J. Appl. Phys. Lett. 89 (2006) 151919
10. Sun J. Eng. Fract. Mech. 44 (1993) 789
11. Sun J., Deng Z.J., and Li Z.H. Int. J. Fract. 42 (1990) R39
12. Sun J. Eng. Fract. Mech. 39 (1991) 799
13. Sun J., Deng Z.J., Li Z.H., and Tu M.J. Eng. Fracture. Mech. 34 (1989)
14. Liu G., Sun J., Nan C.W., and Chen K.H. Acta. Mater. 53 (2005) 3459
15. Liu G., Zhang G.J., Wang R.H., Hu W., Sun J., and Chen K.H. Acta. Mater. 55 (2007) 273
16. Jones Jr. R.E., and Basehore M.L. Appl. Phys. Lett. 50 (1987) 725
17. Marieb T., Mack A.S., Cox N., Gardner D., and Mu X.C. In: Frost H.J., Parker M.A., Ross C.A., and Holm E.A. (Eds). Conference on Polycrystalline Thin Films - Structure, Texture, Properties, and Applications II, Boston, U.S.A., November 27-December 1, 1995. Polycrystalline Thin Films: Structure, Texture, Properties, and Applications II vol. 403 (1995) 639
18. Paik J.M., Park H., and Joo Y.C. Microelectron. Eng. 71 (2004) 348
19. Shen Y.L. J. Vac. Sci. Technol. B. 21 (2003) 1258
20. Rhee S.H., Du Y., and Ho P.S. J. Appl. Phys. 93 (2003) 3926
21. Kitamura T., Hirakata H., and Truong D.V. Thin Solid Films. 515 (2007) 3005
22. Flinn P.A. Mater. Res. Bull. 20 (1995) 70
23. Arzt E. Acta. Mater. 46 (1998) 5611
24. Zhang G.P., Volkert C.A., Schwaiger R., Wellner P., Arzt E., and Kraft O. Acta. Mater. 54 (2006) 3127
25. Blanckenhagen B.Von., Gumbsch P., and Arzt E. Phil. Mag. Lett. 83 (2003) 1
26. Paik J.M., Park I.M., Joo Y.C., and Park K.C. J. Appl. Phys. 99 (2006) 024509