Initiation of interface crack at free edge between thin films with weak stress singularity

Thin Solid Films

Volumn 515, Issue 5, 2007, Pages 3005-3010

  Kitamura, Takayuki ^a   Hirakata, Hiroyuki ^a   Van Truong, Do ^a  

^a KYOTO UNIVERSITY   (Japan)

Author keywords

Aluminum; Crack initiation; Cupper; Gold; Interface strength; Interfaces; Silicon oxide; Stress singularity

Indexed keywords

CRACK INITIATION; INTERFACES (MATERIALS); MICROELECTRONICS; THIN FILMS;

INTERFACE CRACKING; INTERFACE STRENGTH; SILICON OXIDE; STRESS SINGULARITY;

CRACKS;

EID: 33845927388     PISSN: 00406090     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.tsf.2006.08.034     Document Type: Article

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