In situ transmission electron microscopy observations of 1.8 μm and 180 nm Cu interconnects under thermal stresses

Applied Physics Letters

Volumn 89, Issue 15, 2006, Pages

  An, J H ^a   Ferreira, P J ^a  

^a UNIVERSITY OF TEXAS AT AUSTIN   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

DISLOCATION MOTION; DISLOCATION NUCLEATION; QUASIHYDROSTATIC STRESS;

COPPER; GRAIN BOUNDARIES; NUCLEATION; STRESS RELAXATION; THERMAL STRESS; TRANSMISSION ELECTRON MICROSCOPY;

OPTICAL INTERCONNECTS;

EID: 33750017851     PISSN: 00036951     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.2360240     Document Type: Article

References (14)

1. The National Technology Roadmap for Semiconductors, Semiconductor Industry Association, 2005.
2. Baozhen Li, Timothy D. Sullivan, Tom C. Lee, and Dinesh Badami, Microelectron. Reliab. 44, 365 (2004).
3. M. A. Korhonen, P. Borgesen, and Che-Yu Li, MRS Bull., 17, 61 (1992).
4. S. H. Rhee, Ph.D. dissertation, University of Texas, Austin (2001).
5. G. Dehm, D. Weiss, and E. Arzt, Mater. Sci. Eng., A 309-310, 468 (2001).
6. Dongwen Gan, Guotao Wang, and P. S. Ho, Proc. IEEE/IITC, 2002, p. 271.
7. J. A. Nucci, R. R. Keller, D. P. Field, and Y. Shacham-Diamand, Appl. Phys. Lett. 70, 1242 (1997).
8. R. R. Keller, J. A. Nucci, and D. P. Field, J. Electron. Mater. 26, 996 (1997).
9. A. Sekiguchi, J. Koike, S. Kamiya, M. Saka, and K. Maruyama, Appl. Phys. Lett. 79, 1264 (2001).
10. T. J. Balk, G. Dehm, and E. Arzt, Acta Mater. 51, 4471 (2003).
11. H. Mei, J. H. An, R. Huang, and P. J. Ferreira (to be published).
12. L. Vanasupa, D. Pinck, Y.-C. Joo, T. Nogami, S. Pramanick, S. Lopatin, and K. Yang, Electrochem. Solid-State Lett. 2, 275 (1999).
13. M. W. McPherson and C. F. Dunn, J. Vac. Sci. Technol. B 5, 1321 (1987).
14. R. J. Gleixner, B. M. Clemens, and W. D. Nix, J. Mater. Res. 12, 2081 (1997).