The effect of aspect ratio scaling on hydrostatic stress in passivated interconnects

Thin Solid Films

Volumn 515, Issue 6, 2007, Pages 3246-3252

  Ang, D ^a   Wong, C C ^a   Ramanujan, R V ^a  

^a NANYANG TECHNOLOGICAL UNIVERSITY   (Singapore)

Author keywords

Finite element method; Microelectronic reliability; Scaling effects; Stress voiding

Indexed keywords

ALUMINUM COMPOUNDS; ASPECT RATIO; COPPER COMPOUNDS; FINITE ELEMENT METHOD; MATHEMATICAL MODELS; NUMERICAL METHODS;

MICROELECTRONIC RELIABILITY; PASSIVATED METAL INTERCONNECTS; SCALING EFFECTS; STRESS VOIDING;

METAL ANALYSIS;

EID: 33846316374     PISSN: 00406090     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.tsf.2006.01.053     Document Type: Article

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