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Volumn 38, Issue 3, 2009, Pages 379-391

Electromigration-induced plasticity: Texture correlation and implications for reliability assessment

Author keywords

Copper; Dislocations; Electromigration; Interconnects; Plasticity; Reliability; Texture; X ray microdiffraction

Indexed keywords

CU-INTERCONNECTS; DISLOCATIONS; EFFECTIVE DIFFUSIVITIES; HIGH CURRENT DENSITIES; IN LINES; INTERCONNECTS; INTERFACE DIFFUSIONS; LIFE TIME ASSESSMENTS; MASS TRANSPORTS; METALLIC INTERCONNECTS; PLASTIC BEHAVIORS; RELIABILITY ASSESSMENTS; SYNCHROTRON TECHNIQUES; TEXTURE; TRANSPORT PROCESS; X-RAY MICRODIFFRACTION;

EID: 59849124766     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-008-0602-5     Document Type: Article
Times cited : (32)

References (27)
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    • J.F. Nye 1953 Acta Metall. 1 153 10.1016/0001-6160(53)90054-6
    • (1953) Acta Metall. , vol.1 , pp. 153
    • Nye, J.F.1
  • 18
    • 0028532844 scopus 로고
    • 10.1016/0956-7151(94)90424-3
    • Z. Suo 1994 Acta Metall. Mater. 42 3581 10.1016/0956-7151(94)90424-3
    • (1994) Acta Metall. Mater. , vol.42 , pp. 3581
    • Suo, Z.1
  • 19
    • 0006868575 scopus 로고    scopus 로고
    • 10.1063/1.360925
    • A.S. Oates 1996 J. Appl. Phys. 79 163 10.1063/1.360925
    • (1996) J. Appl. Phys. , vol.79 , pp. 163
    • Oates, A.S.1


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.