Plasticity-amplified diffusivity: Dislocation cores as fast diffusion paths in CU interconnects

Annual Proceedings - Reliability Physics (Symposium)

Volumn , Issue , 2007, Pages 122-127

  Budiman, A S ^a   Hau Riege, C S ^b   Besser, P R ^b   Marathe, A ^b   Joo, Y C ^c   Tamura, N ^d   Patel, J R ^a,d   Nix, W D ^a  

^a Stanford University

^b ADVANCED MICRO DEVICES   (United States)

^c Seoul National University   (South Korea)

^d LAWRENCE BERKELEY NATIONAL LABORATORY   (United States)

Author keywords

Dislocation core; Electromigration; Plasticity; Reliability assessment

Indexed keywords

COPPER; ELECTROMIGRATION; PLASTICITY; RELIABILITY ANALYSIS;

DISLOCATION CORES; INTERFACE DIFFUSION; RELIABILITY ASSESSMENT;

MASS TRANSFER;

EID: 34548726178     PISSN: 00999512     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/RELPHY.2007.369880     Document Type: Conference Paper

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