Interface controlled diffusional creep of nanocrystalline pure copper

Scripta Materialia

Volumn 41, Issue 7, 1999, Pages 755-759

  Cai, B ^a   Kong, Q P ^a   Lu, L ^b   Lu, K ^b  

^a INSTITUTE OF SOLID STATE PHYSICS   (China)

^b INSTITUTE OF METAL RESEARCH   (China)

Author keywords

[No Author keywords available]

Indexed keywords

ACTIVATION ENERGY; ANNEALING; CREEP; CREEP TESTING; DIFFUSION IN SOLIDS; ELECTRODEPOSITION; GRAIN BOUNDARIES; GRAIN SIZE AND SHAPE; INTERFACES (MATERIALS); NANOSTRUCTURED MATERIALS; POINT DEFECTS; STRESS ANALYSIS;

INTERFACE CONTROLLED DIFFUSIONAL CREEP; TENSILE CREEP;

COPPER;

EID: 0032642756     PISSN: 13596462     EISSN: None     Source Type: Journal    
DOI: 10.1016/S1359-6462(99)00213-4     Document Type: Article

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