Unexpected mode of plastic deformation in Cu damascene lines undergoing electromigration

Materials Research Society Symposium Proceedings

Volumn 812, Issue , 2004, Pages 345-350

  Budiman, Arief S ^a   Tamura, N ^b   Valek, B C ^b   Gadre, K ^c   Maiz, J ^c   Spolenak, R ^d   Caldwell, W A ^b   Nix, W D ^a   Patell, J R ^a,b  

^a Stanford University   (United States)

^b LAWRENCE BERKELEY NATIONAL LABORATORY   (United States)

^c INTEL CORPORATION   (United States)

^d MAX PLANCK INSTITUTE FOR INTELLIGENT SYSTEMS   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

ALUMINUM ALLOYS; CATHODES; CHARGE COUPLED DEVICES; COPPER; CURRENT DENSITY; ELECTROMIGRATION; INTERCONNECTION NETWORKS; MICROELECTRONICS; PLASTICITY; POINT DEFECTS; SCANNING; SEMICONDUCTOR DEVICE MANUFACTURE; X RAY DIFFRACTION ANALYSIS;

ELECTROMIGRATION DAMAGE; LAUE DIFFRACTION PATTERN; SUBGRAIN STRUCTURES; X-RAY MICRODIFFRACTION;

PLASTIC DEFORMATION;

EID: 12844288624     PISSN: 02729172     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1557/proc-812-f7.3     Document Type: Conference Paper

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