An argument for proof testing brittle microsystems in high-reliability applications

Journal of Micromechanics and Microengineering

Volumn 18, Issue 11, 2008, Pages

  Boyce, B L ^a   Ballarini, R ^b   Chasiotis, I ^c  

^a SANDIA NATIONAL LABORATORIES   (United States)

^b UNIVERSITY OF MINNESOTA   (United States)

^c United States of America   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

APPLICATIONS; COMPOSITE MICROMECHANICS; DIAMONDS; ELECTROMECHANICAL DEVICES; MEMS; MICROELECTROMECHANICAL DEVICES; RELIABILITY; SILICON CARBIDE; WEIBULL DISTRIBUTION;

BRITTLE MATERIALS; BROAD DISTRIBUTIONS; COMPONENT RELIABILITIES; CRITICAL DEFECTS; CRITICAL FAILURES; FAILURE STRENGTHS; MICRO-ELECTRO-MECHANICAL SYSTEMS; RELIABILITY APPLICATIONS; SENSOR AND ACTUATORS; STRUCTURAL RELIABILITIES; TESTING METHODOLOGIES; WEIBULL MODULUS;

MATERIALS TESTING;

EID: 58149343290     PISSN: 09601317     EISSN: 13616439     Source Type: Journal    
DOI: 10.1088/0960-1317/18/11/117001     Document Type: Article

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