Characterization of strength properties of thin polycrystalline silicon films for MEMS applications

Fatigue and Fracture of Engineering Materials and Structures

Volumn 30, Issue 1, 2007, Pages 2-12

  Boroch, Robert ^a   Wiaranowski, J ^a   Mueller Fiedler, R ^a   Ebert, M ^b   Bagdahn, J ^b  

^a ROBERT BOSCH GMBH   (Germany)

^b FRAUNHOFER INSTITUTE FOR MECHANICS OF MATERIALS IWM   (Germany)

Author keywords

Fracture strength; Polysilicon; Strength prediction; Weibull distribution

Indexed keywords

BENDING STRENGTH; FRACTURE TOUGHNESS; MICROELECTROMECHANICAL DEVICES; PROBABILITY; STATISTICAL METHODS; STRESS CONCENTRATION; TENSILE STRENGTH; THIN FILMS; WEIBULL DISTRIBUTION;

PROBABILISTIC STRENGTH; STRENGTH PREDICTION;

POLYSILICON;

EID: 33846301092     PISSN: 8756758X     EISSN: 14602695     Source Type: Journal    
DOI: 10.1111/j.1460-2695.2006.01055.x     Document Type: Article

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