Very high-cycle fatigue failure in micron-scale polycrystalline silicon films: Effects of environment and surface oxide thickness

Journal of Applied Physics

Volumn 101, Issue 1, 2007, Pages

  Alsem, D H ^a,b   Timmerman, R ^c   Boyce, B L ^d   Stach, E A ^e   De Hosson, J Th M ^b   Ritchie, R O ^a,b  

^a Lawrence Berkeley National Laboratory   (United States)

^b LAWRENCE BERKELEY NATIONAL LABORATORY   (United States)

^c UNIVERSITY OF GRONINGEN   (Netherlands)

^d SANDIA NATIONAL LABORATORIES   (United States)

^e PURDUE UNIVERSITY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

FATIGUE CYCLING; MULTIUSER MICROELECTROMECHANICAL SYSTEM PROCESS (MUMPS); POLYCRYSTALLINE SILICON STRUCTURAL FILMS; STRESS-LIFETIME;

COMPRESSIVE STRENGTH; FAILURE (MECHANICAL); MICROELECTROMECHANICAL DEVICES; PLASTIC FILMS; POLYCRYSTALLINE MATERIALS; SILICON; TRANSMISSION ELECTRON MICROSCOPY;

FATIGUE OF MATERIALS;

EID: 33846317094     PISSN: 00218979     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.2403841     Document Type: Article

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