Wafer bonding by low-temperature soldering

Sensors and Actuators, A: Physical

Volumn 85, Issue 1, 2000, Pages 330-334

  Lee, Chengkuo ^a   Huang, Wei Feng ^b   Shie, Jin Shown ^b  

^a Metrodyne Microsystem Corporation   (Taiwan)

^b NATIONAL CHIAO TUNG UNIVERSITY   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

INDIUM ALLOYS; METALLOGRAPHIC MICROSTRUCTURE; MICROELECTROMECHANICAL DEVICES; MICROSENSORS; PACKAGING; PRODUCTION ENGINEERING; RELIABILITY; SEALING (FINISHING); SOLDERING; TENSILE STRENGTH; THERMAL EFFECTS; THERMOANALYSIS;

ANODIC BONDING; SILICON FUSION BONDING; WAFER BONDING;

SILICON WAFERS;

EID: 0034246546     PISSN: 09244247     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0924-4247(00)00338-1     Document Type: Article

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