Reliability of in-48Sn solder/Au/Ni/Cu BGA packages during reflow process

Journal of Electronic Materials

Volumn 34, Issue 12, 2005, Pages 1565-1572

  Koo, J A Myeong ^a   Jung, Seung Boo ^a  

^a Sungkyunkwan University   (South Korea)

Author keywords

Ball grid array (BGA); Ball shear test; Electrolytic Au Ni Cu; In 48Sn solder; Interfacial reactions; Intermetallic compound (IMC)

Indexed keywords

GRAIN GROWTH; INTERFACES (MATERIALS); INTERMETALLICS; SOLDERED JOINTS; SUBSTRATES;

BALL GRID ARRAY; BALL SHEAR TEST; INTERFACIAL REACTIONS; REFLOW CONDICTIONS;

SOLDERING ALLOYS;

EID: 30144436784     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-005-0166-6     Document Type: Conference Paper

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