Interfacial reactions in the Pb-free composite solders with indium layers

Journal of Electronic Materials

Volumn 35, Issue 1, 2006, Pages 72-75

  Chen, Sinn Wen ^a   Lin, Shih Kang ^a   Yang, Ching Feng ^a  

^a NATIONAL TSING HUA UNIVERSITY   (Taiwan)

Author keywords

Composite soldering; Indium; Pb free solders

Indexed keywords

COMPOSITE SOLDERING; PB-FREE SOLDERS; REACTION LAYER; SUBSTRATE INTERFACE;

COMPOSITE MATERIALS; INDIUM; INTERFACES (MATERIALS); LEAD; SOLDERING;

SOLDERING ALLOYS;

EID: 32644450653     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-006-0186-x     Document Type: Conference Paper

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