High-temperature non-eutectic indium-tin joints fabricated by a fluxless process

Thin Solid Films

Volumn 414, Issue 2, 2002, Pages 175-179

  Chuang, Ricky W ^a   Lee, Chin C ^a  

^a University of California at Irvine   (United States)

Author keywords

Fluxless bonding; Indium; Non eutectic solders; Tin

Indexed keywords

COMPOSITE MATERIALS; ELECTRONICS PACKAGING; ENERGY DISPERSIVE SPECTROSCOPY; INDIUM; MULTILAYERS; SCANNING ELECTRON MICROSCOPY; SOLDERING; TIN;

SCANNING ACOUSTIC MICROSCOPY;

SOLDERED JOINTS;

EID: 0037158403     PISSN: 00406090     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0040-6090(02)00424-8     Document Type: Article

References (10)