The study of OSP as reliable surface finish of BGA substrate

Proceedings of 6th Electronics Packaging Technology Conference, EPTC 2004

Volumn , Issue , 2004, Pages 149-153

  Chang, David ^a   Bai, Frank ^b   Wang, Y P ^a   Hsiao, C S ^a  

^a SILICONWARE PRECISION INDUSTRIES CO LTD   (Taiwan)

^b Taiwan Printed Circuit Association   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

DISCOLORATION; ELECTRONICS PACKAGING; EMBRITTLEMENT; GROWTH KINETICS; NICKEL ALLOYS; PRINTED CIRCUIT BOARDS; SOLDERED JOINTS; SUBSTRATES; ULTRAVIOLET SPECTROPHOTOMETERS;

HOT AIR SOLDER LEVELING (HASL); ORGANIC SOLDERABILITY PRESERVATIVES (OSP); SURFACE FINISHES; WETTABILITY;

SOLDERING;

EID: 28444457466     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (2)

1. Karel Wengenroth, Eric Stafstrom, "OSPS: Addressing future surface finishing needs," Surface finishes ".
2. S. V. Sattiraju, B. Dang, R. W. Johnson, et al, "Sn/3.0Ag/0.5Cu Wetting Characteristics of Pb-free Solder Pastes and Pb-free PWB Finishes" Proc 51th Electronic Components and Technology Conf, 2001.