Effects of voids on bump chip carrier (BCC++) solder joint reliability

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2002, Pages 992-1000

  Lau, John ^a   Erasmus, Steve ^a   Pan, Stephen ^b  

^a AGILENT TECHNOLOGIES   (United States)

^b Optimal Corporation   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CRACK PROPAGATION; CREEP; FRACTURE; PRINTED CIRCUIT BOARDS; SOLDERED JOINTS;

BUMP CHIP CARRIER (BCC);

CHIP SCALE PACKAGES;

EID: 0036297131     PISSN: 05695503     EISSN: None     Source Type: Journal    
DOI: 10.1109/ECTC.2002.1008222     Document Type: Article

References (26)

1. SMT assembly and solder joint reliability of bump chip carrier (BCC++) packages
2. Effects of voids on SMT solder joint reliability
3. Material failure by void growth to coalescence
4. Voiding in BGA at solder bumping stage
5. Voiding mechanisms in SMT
6. Voiding in microvia
7. Voiding mechanism in BGA assembly