Effect of void formation on thermal fatigue reliability of lead-free solder joints

Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference

Volumn 2, Issue , 2004, Pages 325-329

  Kim, Do Seop ^a   Yu, Qiang ^a   Shibutani, Tadahiro ^a   Sadakata, Nobuyuki ^b   Inoue, Toshiaki ^b  

^a YOKOHAMA NATIONAL UNIVERSITY   (Japan)

^b FUJIKURA LTD   (Japan)

Author keywords

Fatigue strength; FEM; Mechanical fatigue test; Pb free; Solder joint; Void

Indexed keywords

THERMAL FATIGUE; VOID FORMATION;

EUTECTICS; FATIGUE TESTING; FINITE ELEMENT METHOD; LEAD; RELIABILITY; STRAIN; STRENGTH OF MATERIALS; TIN ALLOYS;

SOLDERED JOINTS;

EID: 4444238665     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (4)

1. Qiang YU, Masaki SHIRATORI, Shinya OHISHI, "Development and Application of the Fatigue Testing Machine for the Microstructure," JSME Annual Meeting, 1999, vol. 3, pp. 69-70.
2. Qiang YU, Masaki SHIRATORI, "Thermal Fatigue Reliability Assessment for Solder Joints of BGA Assembly", Proceeding of International Conference on Interpack'99, ASME, EEP-Vol. 26, No. 1, pp. 239-246, 1976.
3. Kitano M., Kumazawa W., Kawai S.: "A New Evaluation Method for the Thermal Fatigue Strength of Solder Joints," ASME, Advances in Electronic Packaging EEP-vol. 1-1, 1992, 301.
4. Manson, S.S.: International Journal of Fracture Mechanics, vol. 2, No. 1, 1966, pp. 327-363