The effect of pulsed direct current substrate bias on the properties of titanium dioxide thin films deposited by filtered cathodic vacuum arc deposition

Thin Solid Films

Volumn 517, Issue 2, 2008, Pages 494-499

  Bendavid, A ^a   Martin, P J ^a   Preston, E W ^a  

^a CSIRO   (Australia)

Author keywords

Anatase; Crystalline structure; Filtered cathodic vacuum arc deposition; Pulsed dc substrate bias; Titanium dioxide; X ray diffraction

Indexed keywords

CAVITY RESONATORS; CRYSTALLINE MATERIALS; DEPOSITION; DIFFRACTION; GLASS; MECHANICAL PROPERTIES; OPTICAL PROPERTIES; OXIDES; REFRACTIVE INDEX; SUBSTRATES; THICK FILMS; THIN FILMS; TITANIUM; TITANIUM DIOXIDE; TITANIUM OXIDES; VACUUM; VACUUM APPLICATIONS; VACUUM DEPOSITION; VACUUM TECHNOLOGY; X RAY ANALYSIS; X RAY DIFFRACTION; X RAY DIFFRACTION ANALYSIS;

AMORPHOUS; ANATASE; ANATASE FILMS; ANATASE TIO; AUXILIARY HEATING; CRYSTALLINE STRUCTURE; DC BIASSED; FILTERED CATHODIC VACUUM ARC DEPOSITION; FILTERED CATHODIC VACUUM ARCS; FREQUENCY RANGES; GLASS SUBSTRATES; HIGH DEPOSITION RATES; INSULATING SUBSTRATES; ION CURRENT DENSITIES; OPTICAL; PHASE TRANSFORMATIONS; PULSED DIRECT CURRENTS; PULSED-DC SUBSTRATE BIAS; RMS ROUGHNESSES; SUBSTRATE BIAS VOLTAGES; SUBSTRATE BIASSED; SUBSTRATE HOLDERS; TITANIUM DIOXIDE THIN FILMS; VOLTAGE AMPLITUDES; X-RAY DIFFRACTIONS;

AMORPHOUS FILMS;

EID: 55049127913     PISSN: 00406090     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.tsf.2008.06.060     Document Type: Article

References (39)

1. Diebold U. Surf. Sci. Rep. 48 (2003) 53
2. Martin N., Rousselot C., Rondot D., Palmino F., and Mercier R. Thin Solid Films 300 (1997) 113
3. Bersani D., Lottici P.P., and Ding X.Z. Appl. Phys. Lett. 72 (1998) 73
4. Fuyuki T., and Matsunami H. Jpn. J. Appl. Phys. 25 (1986) 1288
5. Perry A., and Pulker H.K. Thin Solid Films, 124 (1985) 323
6. Graetzel M. Comments Inorg. Chem., 12 (1991) 93
7. Ikezawa S., Parajulee S., Taga Y., and Hara T. Proceedings of the 9th International Symposium on Sputtering and Plasma Process, Kanazawa, Japan (2007) 244
8. Frach P., Glöß D., Goedicke K., Fahland M., and Gnehr W.-M. Thin Soild Films 445 (2003) 251
9. Sopyan I., Murasawa S., Hashimoto K., and Fujishima A. Chem. Lett. (1994) 723
10. Zhang F., Zeng Z., Ding X., Mao Y., Chen Y., Zhou Z., Yang S., and Liu X. J. Vac. Sci. Technol. A 1 (1983) 1810
11. Bennett J.M., Pelletier E., Albrand G., Borgogno J.P., Lazarides B., Carniglia C.K., Schmell R.A., Allen T.H., Trttle-Hart T., Guenther K.H., and Saxer A. Appl. Optics 28 (1989) 3303
12. Zeman P., and Takabayashi S. Surf. Coat. Technol. 153 (2002) 93
13. Tay B.K., Zhao Z.W., and Chua D.H.C. Mater. Sci. Eng. R. 52 (2006) 1
14. Martin P.J., and Bendavid A. Thin Solid Films 394 (2001) 1
15. Bendavid A., Martin P.J., and Takikawa H. Thin Solid Films 360 (2000) 241
16. Takikawa H., Kimura K., Miyano R., Sakakibara T., Bendavid A., Martin P.J., Matsumuro A., and Tsutsumi K. Thin Solid Films 386 (2001) 276
17. Kelly P.J., et al. J. Vac.Sci. Technol. A19 (2001) 2856.
18. Bell T.J., Bendeli A., Field J.S., Swain M.V., and Thwaite E.G. Metrologia 28 (1991) 463
19. Woollam J.A. WVASE, Commercial Software Manual (1992)
20. Niu E.W., Li L., Lv G.H., Chen H., Feng W.R., Fan S.H., Yang S.Z., and Yang X.Z. Mater. Sci. Eng. A 460-461 (2007) 135
21. Ohno S., Sato D., Kon M., Song P.K., Yoshikawa M., Suzuki K., Frach P., and Shigesato Y. Thin Solid Films 445 (2003) 207
22. Zhang M., Lin G., Dong C., and Wen L. Surf. Coat. Technol. 201 (2007) 7252
23. McCafferty E., and Wightman J.P. Appl. Surf. Sci. 143 (1999) 92
24. Sayers C.N., and Armstrong N.R. Surf. Sci. 77 (1978) 301
25. Chang J.T., Su C.W., and He J.L. Surf. Coat. Technol. 200 (2006) 3027
26. Okimura K., Maeda N., and Shibata A. Thin Solid Films 281-282 (1996) 427
27. Konstantinidis S., Dauchot J.P., and Hecq M. Thin Solid Films 515 (2006) 1182
28. Martin P.J., Netterfield R.P., and Sainty W.G. J. Appl. Phys. 55 (1984) 235
29. Stojanović B.D., Marinković Z.V., Branković G.O., and Fidančevska E. J. Therm. Anal. Calorim. 60 (2000) 595
30. Anders A. Vacuum 67 (2002) 673
31. Andres A. IEEE 19th International Symposium on Discharges and Electrical Insulation in Vacuum, Xi'an, China (2000) 594
32. Löbel P., Huppertz M., and Mergel D. Thin Solid Films 251 (1994) 72
33. Ma W., Lu Z., and Zhang M. Appl. Phys. A 66 (1998) 621
34. Yakovlev V.V., Scarel G., Aita C.R., and Mochizuki S. Appl. Phys. Lett. 76 (2000) 1107
35. Ottermann C.R., and Bange K. Thin Solid Films 286 (1996) 32
36. Martin P.J., Bendavid A., Swain M.V., Netterfield R.P., Kinder T.J., Sainty W.G., Drage D., and Wielunski L. Thin Solid Films 239 (1994) 181
37. Aarik J., Aidla A., Kiisler A.-A., Uustare T., and Sammelselg V. Thin Solid Films 305 (1997) 270
38. Sundgren J.E., Johansson B.O., and Karlsson S.E. Thin Solid Films 80 (1981) 77
39. Matthews A., and Teer D.G. Thin Solid Films 72 (1980) 541