Plasma emission control of reactive sputtering process in mid-frequency mode with dual cathodes to deposit photocatalytic TiO2 films

Thin Solid Films

Volumn 445, Issue 2, 2003, Pages 207-212

  Ohno, S ^a,b   Sato, D ^a   Kon, M ^a   Song, P K ^a   Yoshikawa, M ^b   Suzuki, K ^c   Frach, P ^d   Shigesato, Y ^a  

^a AOYAMA GAKUIN UNIVERSITY   (Japan)

^b BRIDGESTONE CORPORATION   (Japan)

^c Excellent Plaza Shinyokohama 9F   (Japan)

^d FRAUNHOFER INSTITUTE FOR MANUFACTURING TECHNOLOGY AND ADVANCED MATERIALS IFAM   (Germany)

Author keywords

Photocatalyst; Reactive sputtering; Titanium dioxide; Transition region

Indexed keywords

ADHESION; CATHODES; COSTS; CRYSTALLIZATION; DEPOSITION; HYDROPHOBICITY; MAGNETRON SPUTTERING; PHOTOCATALYSIS; POLYMERS; TITANIUM OXIDES; ULTRAVIOLET RADIATION;

PLASMA CONTROL UNIT (PSU); REACTIVE SPUTTERING; TRANSITION REGIONS;

THIN FILMS;

EID: 1642288269     PISSN: 00406090     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0040-6090(03)01152-0     Document Type: Conference Paper

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