Void formation study of flip chip in package using no-flow underfill

IEEE Transactions on Electronics Packaging Manufacturing

Volumn 31, Issue 4, 2008, Pages 297-305

  Lee, Sangil ^a   Yim, Myung Jin ^b,c   Master, Raj N ^d   Wong, C P ^b   Baldwin, Daniel F ^a  

^a GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

^b Georgia Institute of Technology   (United States)

^c Numonyx Inc   (United States)

^d ADVANCED MICRO DEVICES   (United States)

Author keywords

Chemical reaction; Fine pitch; Flip chip; High I O density; No flow underfill; Reliability; Void formation

Indexed keywords

ASSEMBLY; BRAZING; CHEMICAL PROPERTIES; CHEMICAL REACTIONS; MATERIALS PROPERTIES; NEWTONIAN FLOW; RELIABILITY; WELDING;

FINE PITCH; FLIP CHIP; HIGH I/O DENSITY; NO-FLOW UNDERFILL; VOID FORMATION;

FLIP CHIP DEVICES;

EID: 54249091603     PISSN: 1521334X     EISSN: None     Source Type: Journal    
DOI: 10.1109/TEPM.2008.2002951     Document Type: Article

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