Processing of no-flow fluxing underfill for flip chip assembly

2002 Proceedings - 8th International Advanced Packaging Materials Symposium

Volumn , Issue , 2002, Pages 232-237

  Lazarakis, Theodore L ^a   Baldwin, Daniel F ^a  

^a GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

Direct Chip Attach; Flip chip; No flow fluxing underfill; Process Window; Reliability

Indexed keywords

CHARACTERIZATION; ELECTRONICS PACKAGING; FLIP CHIP DEVICES; MANUFACTURE; PACKAGING MATERIALS; RELIABILITY;

DIRECT CHIP ATTACH; FLIP CHIP; FLIP CHIP ASSEMBLIES; FLUXING UNDERFILL; NO-FLOW UNDERFILL MATERIALS; PROCESS WINDOW; UNDERFILL DISPENSING; UNDERFILL MATERIALS;

CHIP SCALE PACKAGES;

EID: 54249162764     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ISAPM.2002.990392     Document Type: Conference Paper

References (4)

1. R.R. Tummala, Fundamentals of Microsystems Packaging, New York, NY: McGraw-Hill, 2001.
2. Thorpe, R, and Baldwin., D. F., "Reliability Analysis of Flip Chip on Board Using No-Flow Underfill Materials," SMTA International Conference Proceedings, San Jose, CA, 1999.
3. th ECTC Proceedings, San Diego, CA, 1999.
4. R.R. Tummala, E.J. Rymaszewski and A.G. Klopfenstein, Microelectronics Packaging Handbook, Second Edition, New York, NY: Chapman & Hall, 1999.