Study on the relationship between the surface composition of copper pads and no-flow underfill fluxing capability

IEEE Transactions on Electronics Packaging Manufacturing

Volumn 22, Issue 4, 1999, Pages 268-273

  Shi, Songhua ^a,b   Lu, Daoqiang ^a,b   Wong, C P ^a,b  

^a IEEE

^b GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CLEANING; COMPOSITION EFFECTS; COPPER OXIDES; ENCAPSULATION; FLUXES; PRINTED CIRCUIT BOARDS; SOLDERED JOINTS; WETTING; X RAY PHOTOELECTRON SPECTROSCOPY;

NO-FLOW UNDERFILL FLUXING;

ELECTRONICS PACKAGING;

EID: 0033333716     PISSN: 1521334X     EISSN: None     Source Type: Journal    
DOI: 10.1109/6104.816093     Document Type: Article

References (12)

1. R. Marrs, "Trends in IC packaging," Electron. Packag. Prod., pp. 24-30, Aug. 1996.
2. R. R. Tummala, E. J. Rymaszewski, and A. Klopfenstein, Microelectronics Packaging Handbook. New York: Chapman & Hall, 1997.
3. F. Nakano, T. Soga, and S. Amagi, "Resin-insertion effect on thermal cycle resistivity of flip-chip mounted LSI devices," in Proc. Int. Soc. Hybrid Microelectron. Conf., 1987, pp. 536-541.
4. D. Suryanarayana, R. Hsiao, T. P. Gall, and J. M. McCreary, "Flip-chip solder bump fatigue life enhanced by polymer encapsulation," in Proc. IEEE Electron. Comp. Technol. Conf., 1990, pp. 338-344.
5. D. Suryanarayana and D. S. Farquhar, Chapter 12: "Underfill encapsulant for flip chip applications," Chip on Board, J. H. Lau Ed. New York: Van Nostrand Reinhold, 1994.
6. C. P. Wong and D. F. Baldwin, "No-flow underfill for flip-chip packages," U.S. Patent Disclosure (in progress), Apr. 1996.
7. L. Nguyen, L. Hoang, P. Fine, S. H. Shi, M. Vincent, L. Wang, C. P. Wong, Q. Tong, B. Ma, R. Humphreys, and A. Savoca, "High performance underfills development-Materials, process, and reliability," in Proc. PEP'97, Norrköping, Sweden, pp. 300-306, Oct. 1997.
8. C. P. Wong, S. H. Shi, and G. Jefferson, "High performance no-flow underfills for low-cost flip-chip apllications: Material characterization," IEEE Trans. Comp., Packag., Manufact. Technol. A, vol. 21, pp. 450-458, Sept. 1998.
9. _, "High performance no-flow underfills for low-cost flip-chip applications," in Proc. 47th ECTC, San Jose, CA, May 18-21, 1997, pp. 850-858.
10. S. H. Shi and C. P. Wong, "Study of the fluxing agent effects on the properties of no-flow underfill materials for flip-chip applications," in Proc. 48th ECTC, Seattle, WA, May 26-28, 1998, pp. 117-124.
11. C. P. Wong, D. F. Baldwin, M. B. Vincent, B. Fennell, L. J. Wang, and S. H. Shi, "Characterization of a no-flow underfill encapsulant during the solder reflow process," in Proc. 48th ECTC, Seattle, WA, May 26-28, 1998, pp. 1253-1259.
12. J. F. Moulder, W. F. Stickle, P. E. Sobol, and K. D. Bomben, Handbook of X-ray Photoelectron Spectroscopy, Jill Chastain Ed. Eden Prairie, MN: Perkin-Elmer, 1992.