Mechanical reliability of MEMS packages

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2008, Pages 1751-1754

  Van Driel, W D ^a,b   Zaal, J J M ^b   Yang, D G ^a   Van Kleef, M ^a   Zhang, G Q ^a,b  

^a NXP SEMICONDUCTORS   (Netherlands)

^b DELFT UNIVERSITY OF TECHNOLOGY   (Netherlands)

Author keywords

[No Author keywords available]

Indexed keywords

ARSENIC COMPOUNDS; COMPUTER NETWORKS; FAILURE ANALYSIS; FINITE ELEMENT METHOD; MEMS; RELIABILITY; SILICON;

ELECTRONIC COMPONENTS; MEMS DEVICES; MEMS PACKAGING;

COMPOSITE MICROMECHANICS;

EID: 51349100459     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2008.4550217     Document Type: Conference Paper

References (17)

1. C-P. Chang, MEMS for telecommunications: devices and reliability, Proc Custom Integrated Circuits Conference, 2003, pp. 199-206
2. C. T.-C Nguyen, L. P. B. Katehi, G. M. Rebeiz, Micro machined devices for wireless communications, Proc IEEE 86 (8), pp. 1756-1768, Aug. 1998.
3. J. M. Bustillo. R. T. Howe and R. S. Muller, Surface micro machining for micro- electromechanical systems, Proc IEEE 86 (8), pp. 1552-1574.
4. I. de Wolf, Reliability of MEMS, Proc EuroSimE conference, 2006, pp. 1-6.
5. R. Müller-Fiedler, U. Wagner, W. Bernhard, Reliability of MEMS - a methodical approach, Microelectronics Reliability 42 (9-11), 2002, pp. 1771-1776.
6. A. Witvrouw, H.A.C. Tilmans and I. De Wolf, Materials issues in the processing, the operation and the reliability of MEMS, Microelectronic Engineering 76 (1-4), 2004, pp. 245-257.
7. T-R. Hsu, Reliability in MEMS Packaging, Proc Reliability Physics Symposium, 2006, pp. 398-402.
8. X. Du, D. Zhang, T. Lee, Chip level packaging for MEMS using silicon cap, Electronics Manufacturing Technology Symposium, 2004, pp.342-344.
9. M.A. Huff, A.D. Nikolich, M.A. Schmidt, Design of sealed cavity microstructures formed by silicon wafer bonding, J Microelectromechanical Systems 2 (2), 1993 pp. 74-81.
10. G.Q. Zhang, W.D. van Driel, X.J. Fan, Mechanics of Microelectronics, Series: Solid Mechanics and Its Applications, Vol. 141, ISBN: 1-4020-4934-X, 2006.
11. M. Ebert, J. Bagdahn, Determination of residual stress in glass frit bonded MEMS by finite element analysis, Proc EuroSimE conference, 2004, pp. 407-412.
12. D.Y.R. Chong, W.E. Lee, J.H.L. Pang, T.H. Low, B.K. Lim, Mechanical failure strength characterization of silicon dice, Electronics Packaging Technology Conference, 2003.
13. T. Hauck, C. Bohm, W.H. Muller, Weibull statistics for multiple flaw distributions and its application in silicon, Proc. EuroSimE2006, pp. 242-247, 2007.
14. J. Bielen, M. van Gils, F. Theunis, The effect of cyclic hardening in copper heat-sinks on die fracture probability, Proc. EuroSimE2006, pp. 290-296, 2007.
15. A. Jourdain, P. De Moor, S. Pamidighantam, H.A.C. Tilmans, Investigation of the hermeticity of BCB-sealed cavities for housing (RF-)MEMS devices, Micro Electro Mechanical Systems, 2002, pp. 677-680.
16. A. Tetelin, C. Pellet, J-Y. Deletage, B. Carbonne, Y. Danto, Moisture diffusion in BCB resins used for MEMS packaging, Microelectronics Reliability 43, 2003, pp. 19939-1944.
17. J.A.M. Sondag-Huethorst, S. de Jager, C. de Nooijer, R.B.R. van Silfhout, M.H. van Kleef, Dry film package for system in package molding process, Proc Transducers conference Lyon, 2007.