Moisture diffusion in BCB resins used for MEMS packaging

Microelectronics Reliability

Volumn 43, Issue 9-11, 2003, Pages 1939-1944

  Tetelin, A ^a   Pellet, C ^a   Deletage J Y ^a   Carbonne, B ^a   Danto, Y ^a  

^a UNIVERSITÉ BORDEAUX 1   (France)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESIVES; COATINGS; COMPUTER SIMULATION; DIFFUSION; FINITE ELEMENT METHOD; MOISTURE; POLYMERS;

HUMIDITY DIFFUSION;

MICROELECTROMECHANICAL DEVICES;

EID: 0041692449     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0026-2714(03)00329-9     Document Type: Conference Paper

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