Weibull statistics for multiple flaw distributions and its application in silicon fracture prediction

Proceedings of the 6th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems - EuroSimE 2005

Volumn 2005, Issue , 2005, Pages 242-247

  Hauck, Torsten ^a   Bohm, Christina ^a   Müller, Wolfgang H ^b  

^a Freescale GmbH   (Germany)

^b TECHNISCHE UNIVERSITÄT BERLIN   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

FLAW DISTRIBUTIONS; SILICON CHIPS; SILICON FRACTURE; WAFER MANUFACTURING PROCESSES;

ELECTRONIC EQUIPMENT MANUFACTURE; FRACTURE MECHANICS; MICROPROCESSOR CHIPS; PARAMETER ESTIMATION; PROBABILITY; SAWING;

SILICON;

EID: 33745726159     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ESIME.2005.1502808     Document Type: Conference Paper

References (3)

1. Jahresbericht 2003, Fraunhofer Institut für Werkstoffmechanik IWM, (Freiburg, 2003), pp.38-39.
2. Bohm, C, Hauck, T., Müller, W.H., Juritza, A., "Probability of Silicon Fracture in Molded Packages," Proc. EuroSimE 2004, Brussels, May 2004, pp. 75-82.
3. Weibull. W., A Statistical Theory of the Strength of Materials," Ingenieurvetenskaps-akademiens Handlingar, Vol. 151 (1939), pp. 5-45.