Determination of residual stress in glass frit bonded MEMS by finite element analysis

Proceedings of the 5th International Conference on Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2004

Volumn , Issue , 2004, Pages 407-412

  Ebert, Matthias ^a   Bagdahn, Jörg ^a  

^a FRAUNHOFER INSTITUTE FOR MECHANICS OF MATERIALS IWM   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

BONDING; ELASTIC MODULI; FINITE ELEMENT METHOD; MICROELECTROMECHANICAL DEVICES; MICROMACHINING; SCREEN PRINTING; SILICON WAFERS; STRESS CONCENTRATION; SWELLING; TENSILE STRENGTH; VISCOUS FLOW;

GLASS FRIT; ORGANIC BINDERS; ROOM TEMPERATURE; WAFER BONDING;

RESIDUAL STRESSES;

EID: 3843072036     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (8)

1. Bagdahn, J. et al, "Festigkeit und Lebensdauer wafergebondeter mikromechanischer Bauteile", Status Seminar of Project "Mikropruef", Chemnitz (Germany), October 2003
2. Glien et al, "Strength and reliability properties of glass frit bonded micro packages", accepted paper for Conference Design, Test Integration and Packaging of MEMS/MOEMS (DTIP), Montreux, Switzerland, May 2004
3. Graf, J., "Zuverlässigkeit von Seal Glass Verbindungen", Status Seminar of Project "Mikropruef", Chemnitz (Germany), October 2003
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8. Scholze, Horst, Glas Natur, Struktur und Eigenschaften, 3. Aufl., Springer Verlag, 1988