Chip level packaging for MEMS using silicon cap

Proceedings of the IEEE/CPMT International Electronics Manufacturing Technology (IEMT) Symposium

Volumn 29, Issue , 2004, Pages 342-344

  Du, Xianfeng ^a   Zhang, Dacheng ^a   Lee, Ting ^a  

^a PEKING UNIVERSITY   (China)

Author keywords

[No Author keywords available]

Indexed keywords

ACCELEROMETERS; BONDING; DAMPING; INDUCTIVELY COUPLED PLASMA; MICROELECTROMECHANICAL DEVICES; MICROMACHINING; PARAMETER ESTIMATION; SILICA; SOLDERING;

PRESSURE SENSORS; RESONANCE FREQUENCY; SILICON CAPS; SINGLE-CRYSTAL SILICON;

CHIP SCALE PACKAGES;

EID: 4644301655     PISSN: 10898190     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (13)

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