The effect of cyclic hardening in copper heat-sinks on die fracture probability

Proceedings of the 6th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems - EuroSimE 2005

Volumn 2005, Issue , 2005, Pages 290-296

  Bielen, Jeroen ^a   Van Gils, Marcel ^b   Theunis, Frank ^a  

^a NXP SEMICONDUCTORS   (Netherlands)

^b PHILIPS RESEARCH LABORATORIES   (Netherlands)

Author keywords

[No Author keywords available]

Indexed keywords

COPPER HEAT-SINKS; CTE MISMATCH; DIE FRACTURE STRENGTH; TEMPERATURE CYCLING;

CYCLIC LOADS; FRACTURE TOUGHNESS; KINEMATICS; PROBABILISTIC LOGICS; STRENGTH OF MATERIALS; STRESS ANALYSIS; THERMOANALYSIS;

COPPER ALLOYS;

EID: 33745683887     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ESIME.2005.1502816     Document Type: Conference Paper

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