A new method for equivalent acceleration of JEDEC moisture sensitivity levels

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2008, Pages 907-912

  Shi, Daniel ^a   Fan, Xuejun ^b,c   Xie, Bin ^a  

^a HONG KONG APPLIED SCIENCE AND TECHNOLOGY RESEARCH INSTITUTE   (Hong Kong)

^b Lamar University   (United States)

^c SOUTH CHINA UNIVERSITY OF TECHNOLOGY   (China)

Author keywords

[No Author keywords available]

Indexed keywords

ACTIVATION ENERGY; ARSENIC COMPOUNDS; AUTOMOBILE PARTS AND EQUIPMENT; COMPUTER NETWORKS; CONCENTRATION (PROCESS); FAILURE ANALYSIS; HYDROSTATIC PRESSURE; MOISTURE METERS; SENSITIVITY ANALYSIS; STANDARDS; TESTING; THEOREM PROVING; VAPOR PRESSURE;

MOISTURE CONCENTRATION; SOAK TIME;

MOISTURE;

EID: 51349088758     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2008.4550084     Document Type: Conference Paper

References (19)

1. B. Xie and X. Shi, and X.J. Fan, "Accelerated moisture sensitivity test methodology for stacked-die molded matrix array package", Proceedings of IEEE 9th Electronics Packaging Technology Conference, p. 100-104, December 2007
2. Joint Industry Standard J-STD-020, "Moisture/Reflow Sensitivity Classification for Plastic Integrated Circuit Surface Mount Devices", IPC (The Institute for Interconnecting and Packaging Electronic Circuits) and JEDEC (Joint Electron Device Engineering Council), 2004.
3. R. Shook, T. Conrad, V. Sastry and D. Steele, "Diffusion Model to Derate Moisture Sensitive Surface Mount ICs for Factory Use Conditions", IEEE Transaction on Components, Packaging and Manufacturing Technology, Vol. 19, No. 2, pp. 110-118, 1996.
4. R. Shook, R. Vaccaro and D. Gerlach, "Method for Equivalent Acceleration of JEDEC/IPC Moisture Sensitivity Levels", Annual International Reliability Physics Symposium, pp. 214-219, 1998.
5. S. Liu and Y. H. Mei, "Behavior of Delaminated Plastic IC Packages Subjected to Encapsulation Cooling, Moisture Absorption, and Wave Soldering", IEEE Transactions on Components, Packaging, and Manufacturing Technology, Part A, Vol. 18, No. 3, 1995.
6. A. A. O. Tay, and T. Y. Lin, "Moisture Diffusion and Heat Transfer in Plastic IC Packages", IEEE Transactions on Components, Packaging and Manufacturing Technology, Part A, Vol. 19, No. 2, pp. 186-193, 1996.
7. A. A. O. Tay, and T. Y. Lin, "Influence of Temperature, Humidity and Defect Location on Delamination in Plastics Packages", IEEE Transactions on Components, Packaging and Manufacturing Technology, Part A, 22, no. 4, pp. 512-518, 1999.
8. X.J. Fan, "Mechanics of moisture for polymers: fundamental concepts and model study", 8th IEEE International Conference on Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems, (EuroSimE), April 20-23, 2008
9. T. Y. Tee, C. L. Kho, D. Yap, C. Toh, X. Baraton and Z. W. Zhong, "Reliability Assessment and Hygroswelling Modeling of FCBGA with No-flow Underfill", Microelectronics Reliability, 43, pp. 741-749, 2003.
10. X.Q. Shi, Y.L. Zhang, W. Zhou, and X.J. Fan, "Effect of hygrothermal aging on interfacial reliability of silicon/underfill/FR-4 assembly", IEEE Transactions of Components and Packaging Technologies, 2008 (in press).
11. J. Zhou, "Analytical and Numerical Bound Analysis of Hygroscopic Swelling Characterization", Electronic Components and Technology Conference, pp. 734-739, 2006.
12. X.J. Fan, J. Zhou and A. Chandra "Package Structural Integrity Analysis Considering Moisture", Electronic Components and Technology Conference, 2008
13. G. Q. Zhang, W. D. V. Driel, and X. J. Fan, "Mechanics of Microelectronics", Springer, 2006.
14. X.J. Fan, J. Zhou, G. Q. Zhang and L. J. Ernst, "A Micromechanics Based Vapor Pressure Model in Electronic Packages", ASME Journal of Electronic Packaging, 127 (3), pp. 262-267, 2005.
15. X.J. Fan, G. Q. Zhang, W. V. Driel and L. J. Ernst, "Interfacial Delamination Mechanisms during Reflow with Moisture Preconditioning", IEEE Transactions on Components and Packaging Technologies, 2008 (in press).
16. X.J. Fan and T. B. Lim, "Mechanism Analysis for Moisture-induced Failures in IC packages", ASME 1999 International Mechanical Engineering Congress, IMECE/EPE-14, 1999.
17. X.J. Fan, "Moisture Related Reliability in Electronic Packging", 2005/2006/2007/2008 ECTC Professional Development Course Notes, 2005/2006/2007/2008.
18. B. Xie, X.Q. Shi and X.J. Fan, "Sensitivity Investigation of Reflow Profile and Substrate Thickness on Wafer Level Film Failures in 3-D Chip Scale Packages by Finite Element Modeling", Electronic Components and Technology Conference, pp. 242-248, 2007.
19. D. Shi and X.J. Fan, "Wafer Level Film Selection for Stacked-die Chip Scale Packages", Electronic Components and Technology Conference, pp. 1731-1736, 2007.