Accelerated moisture sensitivity test methodology for stacked-die molded matrix array package

Proceedings of the Electronic Packaging Technology Conference, EPTC

Volumn , Issue , 2007, Pages 100-104

  Xie, Bin ^a   Shi, Xunqing ^b   Fan, Xuejun ^c  

^a SHANGHAI JIAO TONG UNIVERSITY   (China)

^b HONG KONG APPLIED SCIENCE AND TECHNOLOGY RESEARCH INSTITUTE   (Hong Kong)

^c Lamar University   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ACCELERATED TESTING; DAMAGE RESPONSE; FAILURE RATES; FINITE ELEMENT ANALYSIS; INTERFACIAL ADHESIONS; MOISTURE CONCENTRATION; MOISTURE DIFFUSION; MOISTURE DISTRIBUTIONS; MOISTURE SENSITIVITY; PACKAGING TECHNOLOGIES; SENSITIVI TY TESTS; SENSITIVITY CLASSIFICATION; SOAK TIME;

CONCENTRATION (PROCESS); DAMAGE DETECTION; DIES; ELECTRONIC EQUIPMENT MANUFACTURE; ELECTRONICS PACKAGING; FINITE ELEMENT METHOD; HYDROSTATIC PRESSURE; MATRIX ALGEBRA; MOISTURE METERS; SENSITIVITY ANALYSIS; STANDARDS; TECHNOLOGY; TESTING; VAPOR PRESSURE; VAPORS;

MOISTURE;

EID: 50049087560     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/EPTC.2007.4469765     Document Type: Conference Paper

References (19)

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