Method for equivalent acceleration of JEDEC/IPC moisture sensitivity levels

Annual Proceedings - Reliability Physics (Symposium)

Volumn , Issue , 1998, Pages 214-219

  Shook, Richard L ^a   Vaccaro, Brian T ^a   Gerlach, Daniel L ^a  

^a NOKIA RESEARCH CENTER   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ACOUSTIC MICROSCOPES; DIFFUSION IN SOLIDS; ELECTRONICS PACKAGING; MOISTURE DETERMINATION; PLASTIC MOLDS; SURFACE MOUNT TECHNOLOGY;

MOISTURE SENSITIVITY LEVEL; PLASTIC SURFACE MOUNT PACKAGES;

SEMICONDUCTOR DEVICE TESTING;

EID: 0031680840     PISSN: 00999512     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/relphy.1998.670553     Document Type: Conference Paper

References (6)