Nanoscale surface and interface engineering: Why plasma-aided?

Surface and Coatings Technology

Volumn 202, Issue 22-23, 2008, Pages 5314-5318

  Ostrikov, K ^a,b,d   Xu, S ^c,d   Huang, S Y ^c,d   Levchenko, I ^b,d  

^a CSIRO   (Australia)

^b UNIVERSITY OF SYDNEY   (Australia)

^c NANYANG TECHNOLOGICAL UNIVERSITY   (Singapore)

^d NANYANG TECHNOLOGICAL UNIVERSITY   (Singapore)

Author keywords

Nanofilms; p n junction; PECVD; Plasma sources; Solar cells; Surface and interface properties

Indexed keywords

CELL MEMBRANES; CHLORINE COMPOUNDS; DIRECT ENERGY CONVERSION; INDUCTIVELY COUPLED PLASMA; MAGNETRON SPUTTERING; NANOSTRUCTURED MATERIALS; NANOTECHNOLOGY; NONMETALS; OPTICAL DESIGN; PHOTORESISTS; PLASMAS; PULSED LASER DEPOSITION; SILICON; SOLAR ENERGY; TECHNOLOGY;

CASE STUDIES; COUPLED PLASMAS; CRYSTALLINE SILICONS; FABRICATION ROUTES; FUNCTIONALIZATION; HIGH-QUALITY; LOW-TEMPERATURE PLASMAS; NANO SCALING; NANO-SCALE FABRICATION; NANO-STRUCTURING; NANOFILMS; NANOSCALES; NANOTEXTURING; NEUTRAL GASES; P-N JUNCTION; PECVD; PLASMA SOURCES; PRE-PATTERNING; RF-MAGNETRON SPUTTERING; SOLAR CELLS; SURFACE AND INTERFACE PROPERTIES; SURFACE AND INTERFACES;

PHASE INTERFACES;

EID: 50349098715     PISSN: 02578972     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.surfcoat.2008.06.165     Document Type: Article

References (32)

1. Oehrlein G.S. Plasma Processing of Electronic Materials (2003), Springer Verlag, Berlin
2. Fridman A., and Kennedy L.A. Plasma Physics and Engineering (2004), Taylor & Francis, New York
3. Ostrikov K. Rev. Mod. Phys. 77 (2005) 489
4. Oba H., Nose K., and Yoshida T. Surf. Coat. Technol. 201 (2007) 5502
5. Hiramatsu M., Shiji K., Amano H., and Hori M. Appl. Phys. Lett. 84 (2004) 4708
6. Zaima S., Nakatsuka O., Sakai A., Murota J., and Yasuda Y. Appl. Surf. Sci. 224 (2004) 215
7. Cvelbar U., and Mozetic M. J. Phys. D: Appl. Phys. 40 (2007) 2300
8. Keidar M., Raitses Y., Knapp A., and Waas A.M. Carbon 44 (2006) 1022
9. Keidar M. J. Phys. D: Appl. Phys. 40 (2007) 2388
10. Shieh J., Lin C.H., and Yang M.C. J. Phys. D: Appl. Phys. 40 (2007) 2242
11. Ostrikov K., and Murphy A.B. J. Phys. D 40 (2007) 2223
12. Xu S., Ostrikov K., Long J.D., and Huang S.Y. Vacuum 80 (2006) 626
13. Shiratani M., Koga K., Ando S., Inoue T., Watanabe Y., Nunomura S., and Kondo M. Surf. Coat. Technol. 201 (2007) 5468
14. Shiratani M., Koga K., and Watanabe Y. Thin Sol. Films 427 (2003) 1
15. Ligatchev V., Wong T.K.S., Liu B., and Rusli. J. Appl. Phys. 92 (2002) 4605
16. Huang S.Y., et al. Surf. Rev. Lett. 13 (2006) 123
17. Ren Z., et al. Science 282 (1998) 1105
18. Ostrikov K., Levchenko I., Xu S., Baba S., Huang S.Y., Cheng Q.J., and Long J.D. Thin Sol. Films 516 (2008) 6609
19. Cheng Q.J., Xu S., Long J.D., and Ostrikov K. Appl. Phys. Lett. 90 (2007) 173112
20. Cheng Q.J., Xu S., Long J.D., and Ostrikov K. Chem. Vap. Depos. 13 (2007) 561
21. Zhou W., Zhong X.X., et al. Surf. Coat. Technol. 200 (2006) 6155
22. Tsakadze Z.L., Ostrikov K., and Xu S. Surf. Coat. Technol. 191 (2005) 49
23. Levchenko I., Ostrikov K., Keidar M., and Xu S. Appl. Phys. Lett. 89 (2006) 033109
24. Levchenko I., Ostrikov K., Long J.D., and Xu S. Appl. Phys. Lett. 91 (2007) 113115
25. Denysenko I., and Ostrikov K. Appl. Phys. Lett. 90 (2007) 251501
26. Levchenko I., Ostrikov K., and Tam E. Appl. Phys. Lett. 89 (2006) 223108
27. Yuan L., Zhong X.X., Levchenko I., and Ostrikov K. Plasma Proc. Polym. 4 (2007) 612
28. Ho J.C., Levchenko I., and Ostrikov K. J. Appl. Phys. 101 (2007) 094309
29. Setsuhara Y., Shoji T., Ebe A., Baba S., Yamamoto N., Takahashi K., Ono K., and Miyake S. Surf. Coat. Technol. 174 (2003) 33
30. Denysenko I.B., Xu S., Rutkevych P.P., Long J.D., Azarenkov N.A., and Ostrikov K. J. Appl. Phys. 95 (2004) 2713
31. Azarenkov N.A., Denisenko I.B., and Ostrikov K.N. J. Phys. D: Appl. Phys. 28 (1995) 2465
32. Levchenko I., Ostrikov K., Keidar M., and Xu S. J. Appl. Phys. 98 (2005) 064304