Characterization and optimization of copper chemical mechanical planarization

Journal of Electronic Materials

Volumn 31, Issue , 2002, Pages 1059-1065

  Laursen, Thomas ^a   Grief, Malcolm ^a  

^a SpeedFam IPEC   (United States)

Author keywords

Chemical mechanical polishing (CMP); Copper interconnects; Dual damascene; Erosion; Slurry

Indexed keywords

ABRASIVES; CHEMICAL MECHANICAL POLISHING; COPPER; DEPOSITION; EROSION; INTERCONNECTION NETWORKS; OPTIMIZATION; SEMICONDUCTOR MATERIALS; SLURRIES;

COPPER INTERCONNECTS;

INTEGRATED CIRCUIT MANUFACTURE;

EID: 0036809963     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-002-0043-5     Document Type: Article

References (3)

1. ITRS Roadmap 2000, http://public.itrs.net/Files/2000UpdateFinal/2kUdFinal.htm.
2. Seeichi Kondo, Noriyuki Sakuma, Yoshio Homma, Yasushi Goto, Naofumi Ohashi, Hizuru Yamaguchi, and Nobuo Owada, Proc. IITC 2000, 253 (2000).
3. T. Laursen, S.R. Runnels, S. Basak, M. Grief, and K. Murella, MRS Conf. Proc. ULSI XV, 677 (2000).