Copper CMP integration and time dependent pattern effect

Proceedings of the IEEE 1999 International Interconnect Technology Conference, IITC 1999

Volumn , Issue , 1999, Pages 164-166

  Pan, J Tony ^a   Li, Ping ^a   Wijekoon, Kapila ^a   Tsai, Stan ^a   Redeker, Fritz ^a  

^a APPLIED MATERIALS INC   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CHEMICAL MECHANICAL POLISHING; EROSION;

COPPER CMP; COPPER DISHING; COPPER THICKNESS; FIELD OXIDES; METROLOGY TOOLS; PATTERN EFFECT; TIME DEPENDENT;

COPPER;

EID: 84902396485     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/IITC.1999.787110     Document Type: Conference Paper

References (3)

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2. D.A. Chan, B. Swedek, A. Wiswesser and M. Birang, Proceedings of 1998 IEEE/SEMI Advanced Semiconductor Manufacturing Conference, pp. 377-384
3. O.G. Chekina and L. M. Keer, J. Electrochem. Soc., Vol. 145, No. 6, June 1998, pp. 2100-2106