메뉴 건너뛰기




Volumn , Issue , 2007, Pages 27-39

Mitigating parameter variation with dynamic fine-grain body biasing?

Author keywords

[No Author keywords available]

Indexed keywords

BIAS VOLTAGE;

EID: 47349093600     PISSN: 10724451     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/MICRO.2007.43     Document Type: Conference Paper
Times cited : (82)

References (48)
  • 1
    • 33745785068 scopus 로고    scopus 로고
    • Compensation for within-die variations in dynamic logic by using body-bias
    • June
    • N. Azizi and F. Najm. Compensation for within-die variations in dynamic logic by using body-bias. In NEWCAS, June 2005.
    • (2005) NEWCAS
    • Azizi, N.1    Najm, F.2
  • 3
    • 0036474722 scopus 로고    scopus 로고
    • Impact of die-to-die and within-die parameter fluctuations on the maximum clock frequency distribution for gigascale integration
    • February
    • K. A. Bowman, S. G. Duvall, and J. D. Meindl. Impact of die-to-die and within-die parameter fluctuations on the maximum clock frequency distribution for gigascale integration. Journal of Solid-State Circuits, February 2002.
    • (2002) Journal of Solid-State Circuits
    • Bowman, K.A.1    Duvall, S.G.2    Meindl, J.D.3
  • 5
    • 3042519201 scopus 로고    scopus 로고
    • A low cost individual-well adaptive body bias (IWABB) scheme for leakage power reduction and performance enhancement in the presence of intra-die variations
    • February
    • T. Chen and J. Gregg. A low cost individual-well adaptive body bias (IWABB) scheme for leakage power reduction and performance enhancement in the presence of intra-die variations. In Design, Automation and Test in Europe, February 2004.
    • (2004) Design, Automation and Test in Europe
    • Chen, T.1    Gregg, J.2
  • 6
    • 0142196052 scopus 로고    scopus 로고
    • Comparison of adaptive body bias (ABB) and adaptive supply voltage (ASV) for improving delay and leakage under the presence of process variation
    • October
    • T. Chen and S. Naffziger. Comparison of adaptive body bias (ABB) and adaptive supply voltage (ASV) for improving delay and leakage under the presence of process variation. Transactions on VLSI Systems, October 2003.
    • (2003) Transactions on VLSI Systems
    • Chen, T.1    Naffziger, S.2
  • 10
    • 47349132220 scopus 로고    scopus 로고
    • Power reduction using LongRun2 in Transmeta's Efficeon processor
    • May
    • D. Ditzel. Power reduction using LongRun2 in Transmeta's Efficeon processor. In Spring Processor Forum, May 2006.
    • (2006) Spring Processor Forum
    • Ditzel, D.1
  • 16
    • 52949144800 scopus 로고    scopus 로고
    • The impact of systematic process variations on symmetrical performance in chip multi-processors
    • April
    • E. Humenay, D. Tarjan, and K. Skadron. The impact of systematic process variations on symmetrical performance in chip multi-processors. In Design, Automation and Test in Europe, April 2007.
    • (2007) Design, Automation and Test in Europe
    • Humenay, E.1    Tarjan, D.2    Skadron, K.3
  • 17
    • 47349123618 scopus 로고    scopus 로고
    • International Technology Roadmap for Semiconductors
    • International Technology Roadmap for Semiconductors (1999).
    • (1999)
  • 18
    • 47349123930 scopus 로고    scopus 로고
    • International Technology Roadmap for Semiconductors (2006 Update).
    • International Technology Roadmap for Semiconductors (2006 Update).
  • 20
    • 0346895152 scopus 로고    scopus 로고
    • How much variability can designers tolerate?
    • November-December
    • A. Kahng. How much variability can designers tolerate? Design & Test of Computers, November-December 2003.
    • (2003) Design & Test of Computers
    • Kahng, A.1
  • 22
    • 34548120810 scopus 로고    scopus 로고
    • Adaptation to temperature-induced delay variations in logic circuits using low-overhead online delay calibration
    • March
    • S. Krishnamurthy, S. Paul, and S. Bhunia. Adaptation to temperature-induced delay variations in logic circuits using low-overhead online delay calibration. In International Symposium on Quality Electronic Design, March 2007.
    • (2007) International Symposium on Quality Electronic Design
    • Krishnamurthy, S.1    Paul, S.2    Bhunia, S.3
  • 23
    • 33748584309 scopus 로고    scopus 로고
    • Mathematically assisted adaptive body bias (ABB) for temperature compensation in gigascale LSI systems
    • January
    • S. V. Kumar, C. H. Kim, and S. S. Sapatnekar. Mathematically assisted adaptive body bias (ABB) for temperature compensation in gigascale LSI systems. In Asia South Pacific Design Automation Conference, January 2006.
    • (2006) Asia South Pacific Design Automation Conference
    • Kumar, S.V.1    Kim, C.H.2    Sapatnekar, S.S.3
  • 25
    • 40349098498 scopus 로고    scopus 로고
    • Mitigating the impact of process variations on processor register files and execution units
    • December
    • X. Liang and D. Brooks. Mitigating the impact of process variations on processor register files and execution units. In International Symposium on Microarchitecture, December 2006.
    • (2006) International Symposium on Microarchitecture
    • Liang, X.1    Brooks, D.2
  • 26
    • 0036917242 scopus 로고    scopus 로고
    • Combined dynamic voltage scaling and adaptive body biasing for lower power microprocessors under dynamic workloads
    • November
    • S. M. Martin, K. Flautner, T. Mudge, and D. Blaauw. Combined dynamic voltage scaling and adaptive body biasing for lower power microprocessors under dynamic workloads. In International Conference on Computer Aided Design, November 2002.
    • (2002) International Conference on Computer Aided Design
    • Martin, S.M.1    Flautner, K.2    Mudge, T.3    Blaauw, D.4
  • 30
    • 1342287051 scopus 로고    scopus 로고
    • Characterization of spatial intrafield gate CD variability, its impact on circuit performance, and spatial mask-level correction
    • February
    • M. Orshansky, L. Milor, and C. Hu. Characterization of spatial intrafield gate CD variability, its impact on circuit performance, and spatial mask-level correction. Transactions on Semiconductor Manufacturing, February 2004.
    • (2004) Transactions on Semiconductor Manufacturing
    • Orshansky, M.1    Milor, L.2    Hu, C.3
  • 35
    • 47349096179 scopus 로고    scopus 로고
    • P. J. Ribeiro and P. J. Diggle. geoR: a package for geostatistical analysis. RNEWS, 2001.
    • P. J. Ribeiro and P. J. Diggle. geoR: a package for geostatistical analysis. RNEWS, 2001.
  • 36
    • 0025415048 scopus 로고
    • Alpha-power law MOSFET model and its applications to CMOS inverter delay and other formulas
    • April
    • T. Sakurai and R. Newton. Alpha-power law MOSFET model and its applications to CMOS inverter delay and other formulas. Journal of Solid-State Circuits, April 1990.
    • (1990) Journal of Solid-State Circuits
    • Sakurai, T.1    Newton, R.2
  • 39
    • 0031077147 scopus 로고    scopus 로고
    • Analysis and decomposition of spatial variation in integrated circuit processes and devices
    • February
    • B. Stine, D. Boning, and J. Chung. Analysis and decomposition of spatial variation in integrated circuit processes and devices. Transactions on Semiconductor Manufacturing, February 1997.
    • (1997) Transactions on Semiconductor Manufacturing
    • Stine, B.1    Boning, D.2    Chung, J.3
  • 41
    • 47349103166 scopus 로고    scopus 로고
    • D. Tarjan, S. Thoziyoor, and N. P. Jouppi. CACTI 4.0. Technical Report HPL-2006-86, HP Labs, 2006.
    • D. Tarjan, S. Thoziyoor, and N. P. Jouppi. CACTI 4.0. Technical Report HPL-2006-86, HP Labs, 2006.
  • 45
    • 0036105965 scopus 로고    scopus 로고
    • Adaptive body bias for reducing impacts of die-to-die and within-die parameter variations on microprocessor frequency and leakage
    • February
    • J. Tschanz, J. Kao, S. Narendra, R. Nair, D. Antoniadis, A. Chandrakasan, and V. De. Adaptive body bias for reducing impacts of die-to-die and within-die parameter variations on microprocessor frequency and leakage. Journal of Solid-State Circuits, February 2002.
    • (2002) Journal of Solid-State Circuits
    • Tschanz, J.1    Kao, J.2    Narendra, S.3    Nair, R.4    Antoniadis, D.5    Chandrakasan, A.6    De, V.7
  • 48
    • 34249306904 scopus 로고    scopus 로고
    • HotLeakage: A temperature-aware model of subthreshold and gate leakage for architects
    • Technical Report CS-2003-05, University of Virginia, March
    • Y. Zhang, D. Parikh, K. Sankaranarayanan, K. Skadron, and M. Stan. HotLeakage: A temperature-aware model of subthreshold and gate leakage for architects. Technical Report CS-2003-05, University of Virginia, March 2003.
    • (2003)
    • Zhang, Y.1    Parikh, D.2    Sankaranarayanan, K.3    Skadron, K.4    Stan, M.5


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.