The 3rd dimension - More life for moore's law

2006 International Microsystems, Packaging,Assembly Conference Taiwan, IMPACT - Proceedings of Technical Papers

Volumn , Issue , 2006, Pages 15-20

  Yu, C H ^a  

^a TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

BONDING; CHIP SCALE PACKAGES; DIGITAL DEVICES; ELECTRONIC EQUIPMENT MANUFACTURE; MICROSYSTEMS; PROCESS DESIGN; PROCESS ENGINEERING; SILICON WAFERS; THREE DIMENSIONAL;

CIRCUIT DESIGNS; FORM FACTORS; HETEROGENEOUS INTEGRATION; INTERNATIONAL (CO); LOWER COST; MASS PRODUCTION; MOORE'S LAWS; PROCESS TECHNOLOGIES; STRONG DEMAND; TECHNICAL PAPERS; THREE DIMENSIONAL (3D); THROUGH SILICON VIA; WAFER THINNING;

WAFER BONDING;

EID: 46249095505     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/IMPACT.2006.312181     Document Type: Conference Paper

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