Creep properties of Sn-rich solder joints

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2003, Pages 54-57

  Morris Jr , J W ^a,b   Song, H G ^a,b   Hua, Fay ^c  

^a Lawrence Berkeley National Laboratory   (United States)

^b LAWRENCE BERKELEY NATIONAL LABORATORY   (United States)

^c INTEL CORPORATION   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CREEP TESTING; DESIGN FOR TESTABILITY; MICROELECTRONIC PROCESSING; SOLDERING; THERMAL EFFECTS;

CREEP PROPERTIES; TIN RICH SOLDER JOINTS;

ELECTRON DEVICE MANUFACTURE;

EID: 0038351738     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

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