Experimental characterization of material properties of 63Sn37Pb flip chip solder joints

Materials Research Society Symposium - Proceedings

Volumn 515, Issue , 1998, Pages 233-238

  Wiese, S ^a   Feustel, F ^a   Rzepka, S ^a   Meusel, E ^a  

^a DRESDEN UNIVERSITY OF TECHNOLOGY   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER SIMULATION; CREEP TESTING; FINITE ELEMENT METHOD; FLIP CHIP DEVICES; MICROSTRUCTURE; RELAXATION PROCESSES; SOLDERED JOINTS; STIFFNESS; THERMAL STRESS; TIN ALLOYS;

SHEAR TESTING; SOFTWARE PACKAGE ANSYS; THERMOMECHANICAL STRESSES;

ELECTRONICS PACKAGING;

EID: 0031628246     PISSN: 02729172     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1557/proc-515-233     Document Type: Conference Paper

References (3)