Extraction of material parameters for creep experiments on real solder-joints by FE analysis

7th International Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems, EuroSimE 2006

Volumn 2006, Issue , 2006, Pages

  Röllig, Mike ^a   Wiese, Steffen ^a   Wolter, Klaus Jürgen ^a  

^a DRESDEN UNIVERSITY OF TECHNOLOGY   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

SOLDER ALLOYS;

CREEP; DIFFUSION; FINITE ELEMENT METHOD; ITERATIVE METHODS; MATHEMATICAL MODELS; TENSILE TESTING;

SOLDERED JOINTS;

EID: 33847110798     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ESIME.2006.1644044     Document Type: Conference Paper

References (10)

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3. St. Wiese, F. Feustel, S. Rzepka, E. Meusel, "Experimental characterization of material properties of 63Sn37Pb Flip Chip solder joints", Electronic Packaging Materials Science X- MRS Symposium Proceedings, 1998
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8. S. Déplanque, W. Nüchter, M. Spraul, B. Wunderle, R. Dudek, B. Michel, "Relevance of primary creep in thermo-mechanical cycling for life-time prediction in Sn-based solders", 6th. EuroSimE conference proceedings, 2005
9. th. EuroSimE conference proceedings, 2005
10. J. H. L. Pang, B. S. Xiong, T.H. Low, "Creep and fatigue Charcterization of lead free 95.5Sn-3.8Ag-0.7Cu solder", Electronic Components and Technology Conference, 2004