A novel high aspect ratio technology for MEMS fabrication using standard silicon wafers

Sensors and Actuators, A: Physical

Volumn 97-98, Issue , 2002, Pages 691-701

  Bertz, Andreas ^a   Küchler, Matthias ^b   Knöfler, Roman ^a   Gessner, Thomas ^a,b  

^a CHEMNITZ UNIVERSITY OF TECHNOLOGY   (Germany)

^b FRAUNHOFER IZM   (Germany)

Author keywords

High aspect ratio structures; Micromachining; Oscillator; Single crystal silicon

Indexed keywords

CAPACITANCE; DRY ETCHING; INTERCONNECTION NETWORKS; LITHOGRAPHY; MASKS; MICROMACHINING; MICROSTRUCTURE; OSCILLATORS (ELECTRONIC); SILICA; SILICON WAFERS; SINGLE CRYSTALS; THIN FILMS;

AIR GAP INSULATED MICROSTRUCTURES; BULK MICROMACHINING; HIGH ASPECT RATIO STRUCTURES; SURFACE MICROMACHINING;

MICROELECTROMECHANICAL DEVICES;

EID: 0036544009     PISSN: 09244247     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0924-4247(02)00006-7     Document Type: Conference Paper

References (9)

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