Stress in high rate deposited silicon dioxide films for MCM applications

Annual Proceedings - Reliability Physics (Symposium)

Volumn , Issue , 1996, Pages 274-280

  Haque, M S ^a   Naseem, H A ^a   Brown, W D ^a  

^a UNIVERSITY OF ARKANSAS   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ANNEALING; CHEMICAL VAPOR DEPOSITION; ELECTRIC WIRING; ELECTRONICS PACKAGING; SILICA; STRESS ANALYSIS; STRESSES; THICK FILMS;

HIGH RATE DEPOSITED SILICON DIOXIDE FILMS; PLASMA ENHANCED CHEMICAL VAPOR DEPOSITION;

MULTICHIP MODULES;

EID: 0029718415     PISSN: 00999512     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/relphy.1996.492130     Document Type: Conference Paper

References (12)