Electrical and adhesion properties of plasma-polymerized ultra-low k dielectric films with high thermal stability

Microelectronic Engineering

Volumn 50, Issue 1-4, 2000, Pages 7-14

  Uhlig, M ^a   Bertz, A ^a   Rennau, M ^a   Schulz, S E ^a   Werner, T ^a   Gessner, T ^a  

^a CHEMNITZ UNIVERSITY OF TECHNOLOGY   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESION; ANNEALING; CHEMICAL POLISHING; DIELECTRIC FILMS; INTEGRATED CIRCUIT MANUFACTURE; PERMITTIVITY; PLASMA ENHANCED CHEMICAL VAPOR DEPOSITION; PLASMA POLYMERIZATION; PLASTIC FILMS; SILICA; THERMODYNAMICS;

CHEMICAL MECHANICAL POLISHING (CMP);

SEMICONDUCTING SILICON COMPOUNDS;

EID: 0033639604     PISSN: 01679317     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0167-9317(99)00258-0     Document Type: Article

References (6)

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6. G. Schwartz, C.H. Ting, The 1994 VLSI/ULSI Multilevel Interconnection Technology Roadmap Summary, T.E. Wade (Ed.), VLSI Multilevel Interconnect Conference, 1994, p. 86.