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Volumn 15, Issue 7, 2005, Pages

Surface micromachined membranes for wafer level packaging

Author keywords

[No Author keywords available]

Indexed keywords

ETCHING; HOLE MOBILITY; MEMBRANES; PHOTORESISTS; POLYMERS; STRESS ANALYSIS; SURFACE PHENOMENA; THICKNESS MEASUREMENT; VISCOSITY OF LIQUIDS;

EID: 21044449490     PISSN: 09601317     EISSN: None     Source Type: Journal    
DOI: 10.1088/0960-1317/15/7/007     Document Type: Article
Times cited : (11)

References (20)
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  • 5
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    • Polymers for encapsulation: Materials, processes and reliability
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    • Wong, C.P.1
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    • Sparks D R, Jordan L and Frazee J H 1996 Flexible vacuum-packaging method for resonating micromachines Sensors Actuators A 55 179-83
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  • 8
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    • Yang, H.-A.1    Wu, M.2    Fang, W.3
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    • 2342511565 scopus 로고    scopus 로고
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    • Pan C T 2004 Selective low temperature microcap packaging technique through flip chip and wafer level alignment J. Micromech. Microeng. 14 522-9
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  • 13
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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.