Wafer level encapsulation of microsystems using glass frit bonding

Microsystem Technologies

Volumn 12, Issue 5, 2006, Pages 468-472

  Knechtel, R ^a   Wiemer, M ^b   Fromel J ^b  

^a X FAB Semiconductor Foundries AG   (Germany)

^b FRAUNHOFER IZM   (Germany)

Author keywords

Encapsulation; Glass frit; Interface and material characterization; MEMS; Wafer bonding

Indexed keywords

BONDING; ENCAPSULATION; GLASS; MICROELECTROMECHANICAL DEVICES; MICROELECTRONICS; SENSORS;

GLASS FRIT; MEMS; WAFER BONDING;

SILICON WAFERS;

EID: 33645160239     PISSN: 09467076     EISSN: None     Source Type: Journal    
DOI: 10.1007/s00542-005-0036-4     Document Type: Conference Paper

References (2)

1. Simon I "Sensorverkapselung: Messtechnische Untersuchungen" HSG-IMIT Report BMBF-Project MANGHO
2. Moraja M, Amiotti A, Longini G (2003) Patterned getter film wafers for wafer level packaging of MEMS. Micro System Technologies München