Selective adhesive bonding with SU-8 for zero-level-packaging

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 5650, Issue , 2005, Pages 163-171

  Reuter, Danny ^a   Bertz, Andreas ^a   Schwenzer, Gunther ^a   Gessner, Thomas ^a,b  

^a CHEMNITZ UNIVERSITY OF TECHNOLOGY   (Germany)

^b FRAUNHOFER IZM   (Germany)

Author keywords

Adhesive bonding; HARMS; SU 8; Zero level packaging

Indexed keywords

ADHESIVES; ASPECT RATIO; BONDING; MICROSTRUCTURE; PHOTORESISTS; SENSORS; SHEAR STRENGTH; SINGLE CRYSTALS; STANDARDS;

ADHESIVE BONDING; HIGH ASPECT RATIO MICROSTRUCTURES (HARMS); SU-8 PHOTORESIST; ZERO-LEVEL PACKAGING;

ELECTRONICS PACKAGING;

EID: 20344364894     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1117/12.581829     Document Type: Conference Paper

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