Application of Moiré interferometry to determine strain fields and debonding of solder joints in BGA packages

IEEE Transactions on Components and Packaging Technologies

Volumn 27, Issue 1, 2004, Pages 217-223

  Liu, Heng ^a   Basaran, Cemal ^b   Cartwright, Alexander N ^b   Casey, William ^c  

^a MEDICAL COLLEGE OF WISCONSIN   (United States)

^b UNIVERSITY AT BUFFALO   (United States)

^c MICRON TECHNOLOGY INC   (United States)

Author keywords

Fatigue test; Interface reliability; Microelectronic packaging; Moir interferometry

Indexed keywords

DEBONDING; FATIGUE TESTING; INTERFEROMETRY; RELIABILITY; SCANNING ELECTRON MICROSCOPY; SOLDERED JOINTS; STRAIN MEASUREMENT;

MOIRE INTERFEROMETRY; THERMOMECHANICAL LOADING;

ELECTRONICS PACKAGING;

EID: 2442566466     PISSN: 15213331     EISSN: None     Source Type: Journal    
DOI: 10.1109/TCAPT.2003.821687     Document Type: Article

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